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Invention: eeprom device manufacturing method

Year    Description
1999Invention patented by Jean-Michel Mirabel on April 22th, 1999. Abstract: The present invention relates to a method of manufacturing, in a P-type substrate including active areas separated by field oxide areas, heavily-doped stop-channel regions under portions of the field insulation areas, more lightly-doped P- and N-type areas meant to form MOS transistor wells, and heavily-doped N-type areas meant to form the first electrode of a capacitor, including the steps of performing a high energy N-type implantation in P-channel MOS transistor areas; performing a high energy P-type implantation in N-channel MOS transistor areas; performing a high energy P-type implantation in stop-channel areas and in capacitor areas; and performing a low energy N-type implantation, masked by the field oxide.
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